Bunching, stranding, and compacting dies

The company’s bunching, stranding and compacting dies are precisely manufactured to assure a well-blended internal profile with polished trumpet entry to guide the wires for consistent surface finish and cable quality with least friction.


PCD
Mikrotek manufactures and supplies bunching, stranding, and compacting dies using polycrystalline diamond blanks. The size range goes from 0.05mm to 32.00mm. This unique diamond mounting process ensures better heat transfer, wear resistance and prolonged die-life at high speed.


MIKROTEK Nano
Mikrotek Nano are available for bunching, stranding, and compacting in dies for sizes ranging from 0.750mm to 150.000 mm. Nano dies give 10X longer life than tungsten carbide.


TC
The company also supplies bunching, stranding and compacting dies using tungsten carbide nibs. The available size range is from 0.200mm to 100.00mm.

Advantages:
- Good conductor surface  
- Low friction on conductor
- Long life

A robust stock of raw materials is maintained to ensure quick deliveries.